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金居不断追求企业之长期生存与发展,对铜箔事业有长远之承诺,并做长期投资之准备、一流设备及产能的扩充、新技术的开发,以因应客户的需要。


CCL/PCB

  • Application : Outer layer
    IT、3C Products HDI, LED car lighting module

    Material
    Product
    Treated side Rz (um)
    Stand Loss
    ≦ 9.5(1oz)
    ≦ 7.2(Hoz)
    mid-Loss & Low Loss
    ≦ 8.0(1oz)
    ≦ 6.0(Hoz)
    Very Low Loss & Ultra Low Loss
    ≦ 3.0
  • Application : Inner layer
    Server, Switch, Storage, Rigid-Flex PCB, Touch module, 3D face recognition, Automotive market

    Material
    Product
    Treated side Rz (um)
    mid-Loss & Low Loss
    ≦ 3.0
    mid-Loss & Low Loss
    ≦ 2.3
    Very Low loss
    ≦ 2.3
    Very Low loss
    ≦ 2.1
    Very Low loss
    ≦ 2.0
    Ultra Low Loss
    ≦ 2.1
    Ultra Low Loss
    ≦ 1.5
    Ultra Low Loss
    ≦ 1.0
    Ultra Low Loss II
    PF511
    N.P.
  • Application : High frequency
    5G Antenna Radar, ADAS

    Material
    Product
    Treated side Rz (um)
    PTFE
    ≦ 3.0
    PTFE
    ≦ 1.5
    Hydrocarbon
    ≦ 9.5

FCCL/FPCB

  • Application : Casting FCCL
    HDI / Rigid-Flex Board, Touch module

    Material
    Product
    Treated side Rz (um)
    Epoxy
    ≦ 4.5(Toz)
    Epoxy
    ≦ 5.5(Hoz)
    Epoxy
    ≦ 8.0(1oz)
    PI
    ≦ 3.0
    PI
    ≦ 2.5
  • Application : Laminate FCCL
    Wearable devices / VR, Augmented Reality, Mobile terminal, 3D face recognition, Communication module

    Material
    Product
    Treated side Rz (um)
    Kaneka Film UBE Film
    ≦ 2.5
    Kaneka Film UBE Film
    ≦ 2.0
  • Application : Laminate FCCL
    5G Antenna, Radar, ADAS

    Material
    Product
    Treated side Rz (um)
    LCP Film / MPI
    ≦ 1.5

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