產品與優勢
產品資訊
金居不斷追求企業之長期生存與發展，對銅箔事業有長遠之承諾，並做長期投資之準備、一流設備及產能的擴充、新技術的開發，以因應客戶的需要。
CCL/PCB
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Application : Outer layer
IT、3C Products HDI, LED car lighting module -
Application : Inner layer
Server, Switch, Storage, Rigid-Flex PCB, Touch module, 3D face recognition, Automotive marketMaterialProductTreated side Rz (um)Ultra Low Loss IIPF511N.P. -
Application : High frequency
5G Antenna Radar, ADASMaterialProductTreated side Rz (um)
FCCL/FPCB
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Application : Casting FCCL
HDI / Rigid-Flex Board, Touch moduleMaterialProductTreated side Rz (um) -
Application : Laminate FCCL
Wearable devices / VR, Augmented Reality, Mobile terminal, 3D face recognition, Communication moduleMaterialProductTreated side Rz (um) -
Application : Laminate FCCL
5G Antenna, Radar, ADASMaterialProductTreated side Rz (um)